LPC1311FHN33 | |
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Part Number | LPC1311FHN33 |
Manufacturer | NXP USA Inc. |
Description | IC MCU 32BIT 8KB FLASH 32HVQFN |
Quantity Available | 16217 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | |
Download | LPC1311FHN33 Details PDF |
LPC1311FHN33 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of LPC1311FHN33 | |||
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Manufacturer Part Number | LPC1311FHN33 | Category | Industrial Controls |
Manufacturer | NXP Semiconductors | Description | IC MCU 32BIT 8KB FLASH 32HVQFN |
Package / Case | 32-HVQFN (7x7) | Quantity Available | 16217 pcs |
Voltage - Supply (Vcc/Vdd) | 2V ~ 3.6V | Supplier Device Package | 32-HVQFN (7x7) |
Speed | 72MHz | Series | LPC13xx |
RAM Size | 4K x 8 | Program Memory Type | FLASH |
Program Memory Size | 8KB (8K x 8) | Peripherals | Brown-out Detect/Reset, POR, WDT |
Package / Case | 32-VQFN Exposed Pad | Package | Bulk |
Oscillator Type | Internal | Operating Temperature | -40°C ~ 85°C (TA) |
Number of I/O | 28 | Mounting Type | Surface Mount |
EEPROM Size | - | Data Converters | A/D 8x10b |
Core Size | 32-Bit Single-Core | Core Processor | ARM® Cortex®-M3 |
Connectivity | I²C, Microwire, SPI, SSI, UART/USART | Base Product Number | LPC1311 |
Download | LPC1311FHN33 PDF - DE.pdfLPC1311FHN33 PDF - FR.pdfLPC1311FHN33 PDF - ES.pdfLPC1311FHN33 PDF - IT.pdfLPC1311FHN33 PDF - KR.pdf |
LPC1311FHN33
32-bit ARM Cortex-M3 Microcontroller
NXP Semiconductors
32-bit ARM Cortex-M3 processor core
Programming In-System and In-Application
Serial Wire Debug and JTAG boundary scan supported
Integrated Nested Vectored Interrupt Controller
UART, I2C, and SPI communication interfaces
Up to 32KB Flash memory
Up to 8KB SRAM
Clock rate up to 72 MHz
Minimal power consumption due to multiple power modes
Fast interrupt handling capability
High system efficiency with low power operation
Consistent performance delivery at varying voltages and temperatures
Architecture: 32-bit ARM Cortex-M3
Up to 72 MHz CPU frequency
Single 3.3V power supply
QFN (Quad-Flat No-leads) package
Form factor: 7 mm x 7 mm body size
Packaged in tape and reel for automated assembly
Manufactured under high industrial standards
Subjected to rigorous testing throughout the manufacturing process
Compact form factor suitable for space-constrained applications
Energy-efficient design ensures prolonged battery life in portable devices
Robust interrupt system for responsive performance
Highly integrated with essential peripherals reducing BOM cost
Competitive performance-to-power ratio in its class
Compatible with a multitude of development and debugging tools
Supports industry-standard communication protocols
Manufactured in compliance with RoHS directives
Meets or exceeds industry standards for quality and reliability
Designed for long operational life under typical usage conditions
Features making it suitable for use in long-life embedded systems
Consumer electronics
Industrial automation
Automotive industry
Internet of Things (IoT) devices
Medical equipment
LPC1311FHN33 Stock | LPC1311FHN33 Price | LPC1311FHN33 Electronics | |||
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LPC1311FHN33 Image | LPC1311FHN33 Picture | LPC1311FHN33 PDF | |||
LPC1311FHN33 Datasheet | Download LPC1311FHN33 Datasheet | Manufacturer NXP Semiconductors |
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